The invention patent "A Design Method for Mini LED Packaging Solder Pad" proposed by Jiangsu Bomin Leng Yajuan, Mao Yongsheng, and Yang Jiahua has been awarded a patent certificate, with authorization announcement number CN 114786344 B.

The existing software design methods usually compensate for the overall expansion of the solder pad, and its four right angles will become curved after being attacked by the development and etching solution of the circuit graphics processing. This will directly cause the appearance of the solder pad to deform and the welding surface into smaller, which is prone to problems such as virtual soldering or poor desoldering in the subsequent client installation process. This patented method cushions the impact of development and etching solution on the main body of the solder pad by adding solid copper angle to the solder pad, ensuring that the main body of the solder pad is square after etching, effectively solving the deformation problem of Mini LED solder pads, and laying the foundation for their mass production.

As an emerging strategic product of our company, Mini LED has been successfully commercialized by Jiangsu Bomin, has multiple customers and achieved mass production and entered a mature and stable stage. In order to meet the needs of customers for new product development and in line with the company's product development path, Jiangsu Bomin is continuously improving its technical capabilities. In the future, the company will continue to vigorously promote technology research and development, further enrich the enterprise's intellectual property matrix, and enhance the company's core competitiveness.